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K. Schäfer u. a., „Magneto-active composites with locally tailored stiffness produced by laser powder bed fusion“, arXiv (Cornell University), Jan. 2023, doi:https://doi.org/10.48550/arxiv.2305.02643
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S. Hirt, M. Pfefferkorn, A. Mesbah und R. Findeisen, „Stability-informed Bayesian Optimization for MPC Cost Function Learning“, arXiv (Cornell University), Apr. 2024, doi:https://doi.org/10.48550/arXiv.2404.12187
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S. Hirt, A. Höhl, J. Schaeffer, J. Pohlodek, R. D. Braatz und R. Findeisen, „Learning Model Predictive Control Parameters via Bayesian Optimization for Battery Fast Charging“, arXiv (Cornell University), Apr. 2024, doi: https://doi.org/10.48550/arXiv.2404.06125
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B. Latsch, N. Schäfer, M. Grimmer, O. Ben Dali, O. Mohseni, N. Bleichner, A. A. Altmann, S. Schaumann, S. I. Wolf, A. Seyfarth, P. Beckerle and M. Kupnik, „3D-Printed Piezoelectric PLA-Based Insole for Event Detection in Gait Analysis”, Submitted to IEEE Sensors Journal
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B. Latsch, N. Schäfer, M. Grimmer, O. Ben Dali, O. Mohseni, N. Bleichner, A. A. Altmann, S. Schaumann, S. I. Wolf, A. Seyfarth, P. Beckerle, and M. Kupnik, “Dataset for Event Detection in Gait Analysis from 3D-Printed Piezoelectric PLA-Based Insole on an Instrumented Treadmill”, Technische Universität Darmstadt, 2024. DOI: 10.48328/tudatalib-1360
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S. Schaumann, B. Latsch, N. Schäfer, O. Ben Dali, J. Seiler, J. Raynaud, M. Grimmer, H. Flor, P. Beckerle and M. Kupnik „Force Myography for Motion Intention Detection Based on 3D-Printed Piezoelectric Sensors”, Submitted to IEEE Sensors Letters,, 2024. DOI: 10.1109/lsens.2024.3417278
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Mahmoudi, A., Khosrotabar, M., Gramann, K., Rinderknecht, S., Sharbafi, M. A., (2024) “Using passive BCI for personalization of assistive w earable devices: a proof-of-concept study”, IEEE Transactions on neural systems and rehabilitation engineering, (Submitted)
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B. Latsch, O. Ben Dali, B. Hench, R. Chadda, Y. Sellami, A. A. Altmann, N. Schäfer, J. Seiler, and M. Kupnik, “Hybrid Sensor Insole for Wearable Ballistocardiography in Remote Health Monitoring”, in 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Tampere, Finland: IEEE, to be published.
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A. A. Altmann, S. Suppelt, O. Ben Dali, B. Latsch, D. G. E. Thiem, and M. Kupnik, “Flexible Shielded Sensors Based on Biocompatible Ferroelectrets for Heart Rate Monitoring”, in 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Tampere, Finland: IEEE, to be published.
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A. A. Altmann, F. Souissi, O. Ben Dali, S. Suppelt, B. Latsch, J. H. Dörsam, S. Zhukov, D. Flachs, and M. Kupnik, “Flexible 3D Printed Ferroelectret Sensors Integrated into Smart Textiles for Unobtrusive Monitoring”, in 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), Tampere, Finland: IEEE, to be published.
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J. Seiler, N. Schäfer, B. Latsch, G. Zhao, M. Grimmer, P. Beckerle, and M. Kupnik, “Human-Exoskeleton Interaction Force Estimation Based on Quasi-Direct Drive Actuators”, in 2024 10th IEEE RAS/EMBS International Conference for Biomedical Robotics and Biomechatronics (BioRob), Heidelberg, Germany: IEEE, to be published.
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B. Latsch, N. Schäfer, S. Schaumann, S. Graffe, A. Mahmoudi, M. Grimmer, A. A. Altmann, O. Ben Dali, S. Rinderknecht, P. Beckerle, and M. Kupnik, “Gait Phase Detection Using 3D-Printed Piezoelectric Force Myography Sensors”, in 2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium, to be published.
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B. Latsch, A. A. Altmann, O. Ben Dali, R. Chadda, N. Schäfer, K. Schäfer, M. B. Khan, J. H. Dörsam, F. Herbst, O. Gutfleisch, and M. Kupnik, “Insole Ballistocardiography for Unobtrusive Respiratory and Heart Rate Monitoring Using 3D-Printed Piezoelectric Sensors”, in 2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium, to be published.
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N. Schäfer, B. Latsch, S. Schaumann, S. Graffe, O. Mohseni, J. Seiler, O. Ben Dali, M. Grimmer, A. Seyfarth, M. Kupnik, and P. Beckerle, “Wearable Ferroelectret Sensors for Muscle Activity Measurements”, in 2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium, to be published.
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A. A. Altmann, S. Suppelt, M. Ruhl, S. Schaumann, B. Latsch, O. Ben Dali, S. Zhukov, D. Flachs, X. Zhang, C. Thielemann, H. von Seggern, and M. Kupnik, “Monolithic Wideband Air-Coupled Ultrasonic Transducer Based on Additively Manufactured Ferroelectrets”, in 2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium, to be published.
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B. Latsch, O. Ben Dali, R. Chadda, N. Schäfer, A. A. Altmann, M. Grimmer, P. Beckerle, and M. Kupnik, “Low Creep 3D-Printed Piezoresistive Force Sensor for Structural Integration”, in 2023 IEEE Sensors, Vienna, Austria: IEEE, Oct. 2023, pp. 1–4. DOI: https://doi.org/10.1109/SENSORS56945.2023.10325114
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Y. Sellami, O. Ben Dali, R. Chadda, S. Zhukov, M. Guermazi, A. A. Altmann, H. von Seggern, B. Latsch, N. Schäfer, and M. Kupnik, “Piezoelectret Sensors from Direct 3D-Printing onto Bulk Films”, in 2023 IEEE Sensors, Vienna, Austria: IEEE, Oct. 2023, pp. 1–4. DOI: 10.1109/sensors56945.2023.10325114
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R. Chadda, O. Ben Dali, B. Latsch, E. Sundaralingam, and M. Kupnik, “3D-Printed Strain Gauges Based on Conductive Filament for Experimental Stress Analysis”, in 2023 IEEE Sensors, Vienna, Austria: IEEE, Oct. 2023, pp. 1–4. DOI: 10.1109/sensors56945.2023.10325276
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O. Ben Dali, Y. Sellami, S. Zhukov, H. von Seggern, N. Schäfer, B. Latsch, G. M. Sessler, P. Beckerle, and M. Kupnik, “Ultrasensitive and low -cost insole for gait analysis using piezoelectrets”, in 2022 IEEE Sensors, Dallas, TX, USA: IEEE, Oct. 30, 2022, pp. 1–4. doi: 10.1109/sensors56945.2023.10324862
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Mahmoudi, A., Khosrotabar, M., Kuhmann, J., Grimmer, M., Rinderknecht, S., Sharbafi, M. A. (2024) “Feasibility of utilizing passive BCI for assistance evaluation: a case study on a knee exoskeleton”, BioRob 2024 (Accepted)
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